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US announces $1.4 billion support for next-generation semiconductor advanced packaging
12:33 CAT | 16 Jan 2025
FILE - Semiconductor chips are seen on a printed circuit board in this illustration picture taken February 17, 2023. [File photo: Reuters/Florence Lo]
The U.S. Department of Commerce on Thursday announced $1.4 billion in final awards to support the next generation of semiconductor advanced packaging.
Source: Reuters
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